- Résumé
- moya2@illinois.edu
- Masters Candidate in Mechanical Engineering – University of Illinois (Expected graduation – May 2017)
- B.S. in Mechanical Engineering – Santa Clara University (June 2014)
- Research Interests: Control, Additive Manufacturing, Mechatronics
Current Work
High power density is desirable in most electronics applications. However, contemporary systems are limited in this regard, as traditional planar circuit boards require external cooling to manage their thermal loads. I am seeking to create devices with higher power densities by moving to a three-dimensional design with embedded thermal transport vias and cooling. My research focuses on combining heterogeneous additive manufacturing with microdevice fabrication and assembly to create compact, fully-integrated 3D electronic circuits.
